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シリコンは地球の地殻で自然に存在する元素です。伝導性を持ち、理想的な半導体材料であるため、直径最大300 mmの半導体ウェハの主要材料となっています。
SiFusionの多結晶シリコンは無配向性結晶状のシリコン元素です。
Physical Properties of Silicon
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| Identification |
Silicon |
| Symbol |
Si |
| State (std. Cond.) |
Solid |
| Atomic |
28.086 |
| Melting Point, ºC |
1,414 |
| Boiling Point, ºC |
2,878 |
| Critical Temperature, ºC |
4,886 |
| Critical Pressure, atm |
530 |
| Critical Volume, cm3/gmol |
232.6 |
| Critical Density, g/cm3 |
0.1207 |
| Vapor Pressure, mm Hg |
2.8(10-4) (at m.p.) |
| Heat of Vaporization, cal/g |
3,812 (at m.p.) |
| Heat of Sublimation, cal/g |
4,705 (at m.p.) |
| Heat of Fusion, cal/g |
264 (at m.p.) |
| Liquid Heat Cap., cal/g mol ºC |
6.755 (at m.p.) |
| Solid Heat Cap., cal/g mol ºC |
4.78 (at 25ºC) |
| Solid heat Cap., JKg/m mol (at 25ºC) |
703 |
| Liquid Density |
2.533 (at m.p.) |
| Solid Density |
2.329 (at 25ºC) |
| Percent Expansion on Freezing |
10% (at m.p.) |
| Surface T |
736 (at m.p.) |
| Liquid Viscosity |
0.88 (at m.p.) |
| Liquid Thermal Cond., cal/sec cmºC |
1.025 (10-3) (at m.p.) |
| Solid thermal cond., cal/sec cmºC |
0.353 (at 25ºC) |
| Solid Thermal Cond., W/m |
163 |
| Hardness, knops Kg/mm |
1150 |
| Hardness, mobs |
7 |
| Bulk Modules, dyne/cm2 |
9.8 (1011) |
| Bulk Modules, Gpa |
102 |
| Young Modulus, dyne/cm2 |
1.3 (1012) |
| Young Modulus, Gpa |
131 |
| Coefficient of Thermal Expansion m/ ºC |
2.6 (10-6) |
| Specific Heat, cal/g ºC |
0.18 |
| Atomic Density, atom cm2 |
4.96 (1022) |
| Refractive Index, 4µ |
3.4255 |
| dn/dt ºC |
1.6 (10-4) |
| Percent Transmission Uncoated, 4µ |
53.8 |
| Transmission Range, µ |
1.2-7 & 45-100 |
| Dielectric |
11.8 |
| Elastic Constant, C11 dyne/cm2 |
1.656 (1012) |
| Elastic Constant, C12 dyne/cm2 |
0.639 (1012) |
| Elastic Constant, C14 dyne/cm2 |
0.795 (1012) |
| Rupture Modules, bending, kg/cm2 |
700-3,500 |
| Breaking Strength, Compression kg/cm2 |
4,900-5,600 |
| Breaking Strength, Compression Mpa |
120 |
| Poisson Ratio |
0.28 | |
シリコンの科学に関するその他の資料:
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